
Principal Thermal Solutions Engineer
Posted Sep 2

Posted Sep 2
This is a fully remote position, open to applicants in Taiwan.
• Build, lead, and expand a high-performing team of thermal engineers throughout Asia.
• Establish technical direction, recruit and mentor team members, and drive field execution.
• Work with Sales to lead technical discussions, define proof-of-concept evaluations, and conduct product demonstrations.
• Assist customer engineering teams during evaluation phases.
• Supervise simulation setups, execute complex test cases, and analyze results to showcase both technical and business value.
• Manage customer onboarding, deployment processes, and account growth.
• Offer senior technical guidance, structured training, and advanced troubleshooting support.
• Identify customer challenges and workflow inefficiencies.
• Collaborate with Product and Engineering teams to translate field feedback into product features.
• Represent Vinci at industry conferences and semiconductor events through technical presentations and live demonstrations.
• Monitor competitive technologies, industry trends, and market positioning.
• Advise customers on thermal management systems, fluid flow dynamics, heat dissipation, thermal risk, component reliability, power density, and cooling efficiency.
• A degree in Mechanical Engineering, Electrical Engineering, or a closely related technical field.
• Expert-level proficiency in commercial simulation software such as Flotherm, Ansys Icepak/Fluent, Simcenter STAR-CCM+, or equivalent.
• Over 15 years of practical experience in thermal management and cooling solutions, either through running simulations or serving as a technical account manager for commercial physics simulation software.
• Extensive knowledge of semiconductor electronics packaging and advanced packaging technologies, including 2.5D/3D IC and foundry ecosystems.
• Previous experience in dedicated customer-facing roles.
• Hands-on programming experience in Python or C++ for workflow automation or simulation data parsing.
• Demonstrated managerial or technical leadership experience.
• Capability to scale, mentor, and drive execution within engineering teams.
• Exceptional interpersonal and communication skills.
• Ability to translate complex physics and simulation results into clear narratives for technical panels and business executives.
• Familiarity with structural mechanical simulations (FEA/stress) and/or Electrical Signal Integrity and Power Integrity (SI/PI) workflows.
• Direct experience in commercializing technical software, preferably EDA or CAE simulation tools, within major semiconductor and electronics enterprises.
• Prior experience in technical pre-sales, application engineering (FAE), or strategic technical sales environments.
• Ability to quickly adopt and advocate for physics-based workflows and AI-assisted design or simulation tools.
• Moderate travel, mostly within Asia.
• Occasional intercontinental travel may be necessary for discussions and collaboration with the US team.
• Opportunity to collaborate with world-class engineers and researchers.
• Fast-paced startup environment.
• Chance to work at the intersection of AI models, fundamental physics, and hardware design.
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