Senior Package Engineer

This is a fully remote position, open to applicants in Singapore.

📋 Description

• Develop, enhance, and assess packaging processes for Wafer-Level Chip Scale Packaging (WLCSP) technologies, which include bumping, RDL formation, underfill, and dicing.

• Conduct root cause analysis and execute corrective and preventive actions utilizing the 8D methodology.

• Work in collaboration with R&D, design, equipment, and manufacturing teams to transition processes from development stages to high-volume production.

• Lead or engage in cross-functional new product introduction (NPI) and process improvement initiatives.

• Assess and qualify new materials, equipment, and processes in alignment with technology roadmaps and production needs.

• Keep abreast of emerging trends and advancements in packaging technology.

• Perform process capability analysis using Cp/Cpk metrics.

• Implement Statistical Process Control (SPC) and continuous improvement efforts to enhance yield, quality, and cost-effectiveness.

• Define and uphold process specifications, control plans, and Standard Operating Procedures (SOPs).

• Offer technical support and training to manufacturing operators and technicians.

⛳️ Requirements

• Proven experience or expertise in Bumping, Flip-chip, and Wafer-Level Chip Scale Packaging (WLCSP) technologies.

• Capability to develop, optimize, characterize, and sustain advanced packaging processes.

• Understanding of bumping, re-distribution layer (RDL) formation, underfill, and dicing.

• Experience in performing root cause analysis and executing corrective and preventive actions using the 8D methodology.

• Proficiency in conducting process capability analysis (Cp/Cpk).

• Familiarity with Statistical Process Control (SPC).

• Ability to define and maintain process specifications, control plans, and standard operating procedures (SOPs).

• Knowledge of materials and packaging/manufacturing equipment.

• Understanding of safety and quality standards, including Good Manufacturing Practices (GMP).

• Capability to provide technical support and training to manufacturing operators and technicians.

• Skill in collaborating with R&D, design, equipment, and manufacturing teams.

• Strong problem-solving abilities, attention to detail, and effective technical communication skills.

🏝️ Benefits

• Quarterly bonuses linked to the achievement of innovation objectives.

• Equity grants.

• A comprehensive and highly competitive compensation package.