
Principal Thermal Solutions Engineer
Posted 15 hours ago

Posted 15 hours ago
This is a fully remote position, open to applicants in Taiwan.
• Build, lead, and scale an exceptional team of thermal engineers throughout Asia.
• Establish technical direction, recruit and mentor team members, and drive field execution.
• Collaborate with Sales to facilitate technical discussions, define proof-of-concept evaluations, and present product demonstrations.
• Assist customer engineering teams with simulation setup, intricate test cases, and data interpretation.
• Showcase Vinci's technical and business value to potential enterprise customers.
• Oversee customer onboarding, deployment pipeline, account growth, training, and advanced troubleshooting.
• Supply product guidance and customer insights to Product and Engineering teams.
• Represent Vinci at industry conferences and semiconductor events through technical presentations and live demonstrations.
• Stay informed about competitive technologies, industry trends, and market positioning.
• A degree in Mechanical Engineering, Electrical Engineering, or a closely related technical discipline.
• Expert-level proficiency in commercial simulation software such as Flotherm, Ansys Icepak/Fluent, Simcenter STAR-CCM+, or equivalent.
• Over 15 years of hands-on experience in thermal management and cooling solutions.
• Extensive knowledge of semiconductor electronics packaging and advanced packaging technologies such as 2.5D/3D IC, or foundry ecosystems.
• Previous experience in dedicated customer-facing roles.
• Practical programming experience using Python or C++ for workflow automation or simulation data parsing.
• Demonstrated managerial or technical leadership experience.
• Exceptional interpersonal and communication skills.
• Professional fluency in Mandarin or Korean.
• Familiarity with structural mechanical simulations, FEA/stress, and/or Electrical Signal Integrity and Power Integrity workflows is a plus.
• Direct experience in commercializing technical software, particularly EDA or CAE simulation tools, is advantageous.
• Previous technical pre-sales, application engineering, or strategic technical sales experience is beneficial.
• Capability to adopt and promote physics-based workflows and AI-assisted design or simulation tools is desirable.
• Moderate travel, primarily within Asia, with occasional intercontinental travel.
• Collaboration with world-class engineers and researchers.
• Fast-paced startup environment.
• Opportunity to work at the intersection of AI models, fundamental physics, and enterprise engineering.
• Chance to contribute to the redefinition of next-generation hardware design.
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