
Principal Thermal Solutions Engineer
Posted 15 hours ago

Posted 15 hours ago
This is a fully remote position, open to applicants in South Korea.
• Build, lead, and expand a high-performing team of thermal engineers throughout Asia.
• Establish technical direction, recruit and mentor team members, and oversee field execution.
• Work closely with Sales to facilitate technical discussions, outline proof-of-concept evaluations, and execute product demonstrations.
• Assist customer engineering teams with simulation setups, complex test scenarios, and analysis of results.
• Showcase Vinci's technical and business value to potential enterprise clients.
• Oversee customer onboarding, deployment processes, account growth, training, and advanced troubleshooting.
• Identify customer challenges and workflow inefficiencies.
• Collaborate with Product and Engineering to transform field feedback into new product functionalities.
• Represent Vinci at industry conferences and semiconductor events through technical presentations and live demonstrations.
• Stay updated on competitive technologies, industry trends, and market positioning.
• Analyze thermal management systems, fluid flow dynamics, heat dissipation, and both steady-state and transient thermal behaviors.
• Assist customers in assessing thermal risk, component reliability, power density, and cooling efficiency.
• Bachelor's degree in Mechanical Engineering, Electrical Engineering, or a closely related technical discipline.
• 15+ years of practical experience in thermal management and cooling solutions.
• Expert-level proficiency in commercial simulation software such as Flotherm, Ansys Icepak/Fluent, Simcenter STAR-CCM+, or equivalent tools.
• Extensive knowledge of semiconductor electronics packaging and advanced packaging technologies, including 2.5D/3D IC or foundry ecosystems.
• Previous experience in dedicated customer-facing roles.
• Practical programming skills in Python or C++ for automating workflows or processing simulation data.
• Demonstrated managerial or technical leadership experience.
• Exceptional interpersonal and communication abilities.
• Professional fluency in Mandarin or Korean.
• Familiarity with structural mechanical simulations (FEA/stress) and/or Electrical Signal Integrity and Power Integrity (SI/PI) workflows.
• Direct experience in commercializing technical software, preferably EDA or CAE simulation tools, within major semiconductor and electronics companies.
• Prior involvement in technical pre-sales, application engineering (FAE), or strategic technical sales settings.
• Capability to adopt and advocate for physics-based workflows and AI-assisted design or simulation tools.
• Flexible remote work arrangement.
• Moderate travel primarily within Asia.
• Occasional intercontinental travel for collaboration with the US team.
• Opportunity to collaborate with world-class engineers and researchers.
• Dynamic and fast-paced startup environment.
• Chance to work at the intersection of AI, fundamental physics, and enterprise engineering.
• Opportunity to contribute to the evolution of next-generation hardware design.
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