
Principal Thermal Solutions Engineer
Posted Oct 30

Posted Oct 30
This is a fully remote position, open to applicants in Singapore.
• Build, lead, and expand a high-performing team of thermal engineers throughout Asia.
• Establish the technical direction, recruit and mentor team members, and drive execution in the field.
• Collaborate with the sales team to steer technical discussions, outline proof-of-concept evaluations, and provide product demonstrations.
• Supervise simulation setups, conduct complex test cases, and analyze results to demonstrate technical and business value.
• Manage customer onboarding, deployment pipeline, account growth, training, and advanced troubleshooting.
• Identify customer challenges and workflow inefficiencies.
• Work with product and engineering teams to transform customer feedback into new product features.
• Represent Vinci at industry conferences and semiconductor events through technical presentations and live demonstrations.
• Monitor competitive technologies, industry trends, and market positioning.
• Analyze thermal management systems, fluid flow dynamics, heat dissipation, and both steady-state and transient thermal behavior.
• Assess thermal risks, component reliability, power density, and cooling efficiency.
• Bachelor’s degree in Mechanical Engineering, Electrical Engineering, or a closely related technical discipline.
• Expert-level proficiency in commercial simulation software such as Flotherm, Ansys Icepak/Fluent, Simcenter STAR-CCM+, or similar tools.
• More than 15 years of practical experience in thermal management and cooling solutions.
• Extensive knowledge of semiconductor electronics packaging, advanced packaging technologies (e.g., 2.5D/3D IC), or foundry ecosystems.
• Experience in dedicated customer-facing roles.
• Practical programming skills in Python or C++ for automating workflows or analyzing simulation data.
• Demonstrated prior experience in managerial or technical leadership roles.
• Exceptional interpersonal and communication abilities.
• Professional fluency in Mandarin or Korean.
• Knowledge of structural mechanical simulations (FEA/stress) and/or Electrical Signal Integrity and Power Integrity (SI/PI) workflows.
• Direct experience in commercializing technical software, preferably EDA or CAE simulation tools, within major semiconductor and electronics companies.
• Previous experience in technical pre-sales, application engineering (FAE), or strategic technical sales roles.
• Capability to adopt and advocate for physics-based workflows and AI-assisted design or simulation tools.
• Remote work options available.
• Moderate travel, primarily within Asia.
• Collaborate with top-tier engineers and researchers.
• Dynamic startup atmosphere.
• Opportunity to work at the intersection of AI models, fundamental physics, and enterprise engineering.
• Chance to contribute to the redefinition of next-generation hardware design.
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