Principal Thermal Solutions Engineer

This is a fully remote position, open to applicants in Singapore.

📋 Description

• Build, lead, and develop a high-performing team of thermal engineers throughout Asia.

• Establish technical direction, recruit and mentor team members, and oversee field execution.

• Work alongside sales to facilitate technical discussions, define proof-of-concept evaluations, and provide product demonstrations.

• Manage simulation setups, execute complex test scenarios, and analyze results to demonstrate technical and business value.

• Take ownership of customer onboarding, deployment processes, account growth, training, and advanced troubleshooting.

• Identify customer challenges and workflow inefficiencies.

• Collaborate with product and engineering teams to transform customer feedback into new product features.

• Represent Vinci at industry conferences and semiconductor events through technical presentations and live demonstrations.

• Monitor competitive technologies, industry trends, and market positioning.

• Analyze thermal management systems, fluid flow dynamics, heat dissipation, and both steady-state and transient thermal behavior.

• Assess thermal risks, component reliability, power density, and cooling efficiency.

⛳️ Requirements

• Bachelor’s degree in Mechanical Engineering, Electrical Engineering, or a closely related technical discipline.

• Expert-level proficiency in commercial simulation software such as Flotherm, Ansys Icepak/Fluent, Simcenter STAR-CCM+, or similar tools.

• Over 15 years of practical experience in thermal management and cooling solutions.

• Extensive knowledge of semiconductor electronics packaging, advanced packaging technologies (e.g., 2.5D/3D IC), or foundry ecosystems.

• Previous experience in roles directly interacting with customers.

• Practical programming skills in Python or C++ for automating workflows or analyzing simulation data.

• Demonstrated prior experience in managerial or technical leadership positions.

• Exceptional interpersonal and communication abilities.

• Professional proficiency in Mandarin or Korean.

• Familiarity with structural mechanical simulations (FEA/stress) and/or Electrical Signal Integrity and Power Integrity (SI/PI) workflows.

• Direct experience in commercializing technical software, ideally EDA or CAE simulation tools, within major semiconductor and electronics companies.

• Prior experience in technical pre-sales, application engineering (FAE), or strategic technical sales environments.

• Ability to adopt and advocate for physics-based workflows and AI-assisted design or simulation tools.

🏝️ Benefits

• Remote work flexibility.

• Occasional travel, mainly within Asia.

• Collaboration with top-tier engineers and researchers.

• Fast-paced startup atmosphere.

• Opportunity to work at the intersection of AI models, fundamental physics, and enterprise engineering.

• Chance to contribute to the redefinition of next-generation hardware design.