PCB Layout Engineering Lead

This is a fully remote position, open to applicants in United States.

📋 Description

• Take ownership of multilayer PCB layout from the initial placement of components to the release of fabrication and assembly.

• Convert schematics, mechanical limitations, and electrical specifications into designs driven by constraints.

• Establish and execute board stackups, controlled-impedance configurations, routing guidelines, reference planes, return paths, and constraints for length and phase matching.

• Place and route high-speed digital circuits, high-current power circuits, and sensitive analog circuits, including dense BGA fanout and differential interfaces.

• Implement best practices for signal integrity and power integrity to reduce crosstalk, discontinuities, noise, voltage drop, and electromagnetic interference.

• Collaborate with engineers from the electrical, SI/PI, mechanical, thermal, compliance, manufacturing, and testing disciplines.

• Engage with fabrication and assembly partners to choose materials, validate stackups and via structures, and enhance yield, cost, and timelines.

• Conduct design reviews along with DFM, DFA, and DFT assessments.

• Produce and validate fabrication drawings, assembly drawings, drill data, Gerbers, ODB++, IPC-2581, and associated release documentation.

• Maintain component footprints, padstacks, design libraries, layout standards, and release documentation.

• Assist with prototype builds, board bring-up, failure analysis, and layout modifications throughout production.

⛳️ Requirements

• A Bachelor’s degree in electrical engineering, electronics engineering, or a related field, or equivalent practical experience.

• Over 10 years of direct experience in designing complex, high-speed, multilayer printed circuit boards.

• Proficiency in Cadence Allegro PCB Designer and Constraint Manager.

• Familiarity with Altium Designer or similar tools.

• In-depth understanding of component placement, controlled-impedance routing, differential pairs, length matching, return-path continuity, and power distribution.

• Experience in dense BGA escape routing, HDI structures, blind and buried vias, microvias, via-in-pad, and backdrilling.

• Practical knowledge of signal integrity, power integrity, EMI/EMC, thermal design, creepage and clearance, and high-current routing.

• Background in applying IPC standards and requirements for fabrication, assembly, testing, and manufacturability.

• Capability to create and evaluate comprehensive PCB fabrication and assembly release packages.

• Ability to excel in a fast-paced, dynamic environment and to adjust to shifting priorities.

• Strong collaborative and interpersonal skills with multidisciplinary teams.

• Experience in server hardware, AI accelerators, hardware accelerators, datacenter, AI Hardware, or enterprise products.

• Preferred: experience in designing large, high-layer-count boards for compute, networking, server, or AI accelerator systems.

• Preferred: experience routing DDR4/DDR5, PCIe Gen4/Gen5 or later, Ethernet, USB, and multi-gigabit SerDes.

• Preferred: familiarity with high-current, low-voltage power delivery, VRM placement, decoupling strategies, copper balancing, and thermal optimization.

• Preferred: experience in developing Allegro SKILL, scripts, or automation.

• Preferred: track record of delivering first-pass functional boards and supporting products from prototype through to volume production.

🏝️ Benefits

• Bonus and equity may be part of the overall compensation package.

• Job security combined with the excitement of a startup environment.

• A straightforward, non-corporate work culture that values individual beliefs.

• Opportunities to publish and contribute to cutting-edge AI research in open source.

• Engage in projects involving one of the world’s fastest AI supercomputers.

• Continuous opportunities for learning, growth, and support.

• An inclusive and diverse work environment.