Senior Packaging Technical Engineer – Hardware

This is a fully remote position, open to applicants in California, +1 more state.

📋 Description

• Define and execute the chip pad ring.

• Establish the substrate interconnect scheme.

• Oversee the package layout design process.

• Collaborate with engineers and managers in Circuit, Signal Integrity, RTL, Place and Route, substrate layout, and system design.

• Determine the chip floor plan, pad ring, substrate, and ball out.

• Develop a robust electrical package.

• Communicate effectively with teams across the organization.

• Design and implement silicon pad rings for various package technology types and complex technologies.

⛳️ Requirements

• BSEE or equivalent experience required.

• A minimum of 8+ years in board/system design experience.

• Preference for experience in package design.

• A solid understanding of transmission line theory, power delivery, and signal integrity is desired.

• Programming and scripting proficiency in Perl, Python, or Tcl is preferred.

• Familiarity with Cadence Skill and Excel is advantageous.

• Must be diligent and capable of working with minimal supervision.

• Strong ability to solve complex technical issues.

🏝️ Benefits

• Highly competitive salaries.

• Comprehensive benefits package.

• Equity opportunities.

• Benefits available for employees and their families.

• An inclusive and supportive work environment.