Packaging Engineer – Materials

This is a fully remote position, open to applicants in California, +2 more states.

📋 Description

• Take charge of wafer level molding and underfill processes, material validation, and assembly integration throughout development and production.

• Spearhead the development of wafer level mold and underfill processes for cutting-edge semiconductor packages, including fan-out wafer level packaging, 2.5D/3D, and chiplet designs.

• Create and refine compression molding, transfer molding, and mold underfill (MUF) processes.

• Choose and validate mold compounds and underfill materials based on factors like filler content, CTE, modulus, Tg, viscosity, and moisture absorption.

• Establish capillary underfill dispense strategies, improve flow and void characteristics, and develop curing profiles for flip chip and chiplet assemblies.

• Assess and address issues such as warpage, delamination, void formation, bleed-out, mold flash, and filler settling; define process parameters and controls.

• Partner with OSATs and material suppliers to assess materials, specify dispense and curing equipment needs, and transition processes to production.

• Analyze mold and underfill material characteristics and link material performance with process results and package reliability.

• Collaborate with thermo-mechanical modeling teams to simulate solder joint reliability and forecast package warpage.

• Assist in reliability qualification tests, which include thermal cycling, drop tests, mechanical shock, and power cycling.

• Engage cross-functionally with design, reliability, thermal, and manufacturing teams from initial concept through to high-volume production.

⛳️ Requirements

• Extensive experience in wafer level molding and underfill processes for advanced semiconductor packages, including fan-out wafer level packaging (FOWLP), 2.5D, and chiplet architectures.

• Thorough knowledge of mold compound and underfill material science, including epoxy resin systems, particle size and loading, cure chemistry, and the impact of material properties on thermo-mechanical package performance.

• Proficient in underfill dispense methods (capillary, no-flow, mold underfill), flow and void analysis, bleed-out management, and optimizing cure processes, including staged and snap cure profiles.

• Knowledgeable about thermo-mechanical behavior influenced by mold and underfill materials, including CTE mismatch, warpage progression during cure and reflow, delamination forces, and reliability risks associated with materials.

• Hands-on background in failure analysis of mold and underfill defects, utilizing techniques such as cross-sections, SEM/EDS, CSAM, TGA, DSC, and DMA for characterizing materials and assessing thermal cycling reliability.

• Capability to collaborate with OSATs and material suppliers in developing, qualifying, and implementing mold and underfill processes in production, encompassing equipment setup and process control strategies.

• Strong analytical skills with the ability to troubleshoot mold and underfill yield and reliability challenges in manufacturing settings, including process optimization driven by DOE.

• Preferred: Experience with underfill materials for III-V or photonics packaging, including optically clear encapsulants and low-modulus underfills.

• Preferred: Familiarity with mold and underfill integration in advanced packaging structures, including 2.5D interposers, 3D stacking, chiplet assemblies, and CoWoS-like systems.

• Preferred: Knowledge of a comprehensive bill of materials for advanced packaging encapsulation, including clear adhesives and underfills for photonics, and high-filler, low-CTE mold compounds for 2.5D interposer assemblies.

• Preferred: Experience in developing mold and underfill solutions for high-power or high-TDP devices.

• Preferred: Exposure to thermo-mechanical modeling or collaboration with simulation teams.

• Preferred: Understanding of system-level interactions, including TIM application and cold plate interaction within wafer level molded wafers.

🏝️ Benefits

• Comprehensive health, dental, and vision insurance.

• Retirement savings plan with company matching.

• Opportunities for professional development and career advancement.

• Flexible work hours and remote work options.

• Employee wellness programs and resources.