
Package Design Engineer
Posted 3 days ago

Posted 3 days ago
This is a fully remote position, open to applicants in Mexico, +4 more countries.
β’ Design physical package substrates for large form-factor packages intended for ML high-performance computers (HPCs).
β’ Create and implement methodologies and CAD workflows to enhance substrate design efficiency and productivity.
β’ Lead and manage co-design efforts across chip, package, and system levels.
β’ Obtain production approval for package designs.
β’ Work collaboratively with SI/PI, thermal, mechanical, assembly, and PCB engineering teams.
β’ Refine and optimize designs for product packages, test vehicles, and mock-up designs to ensure product feasibility.
β’ Oversee routing feasibility studies, test vehicle development, product-level designs, design reviews, artwork export, DFM activities, and final manufacturing documentation.
β’ Define and document the requirements for package substrate design and the bill of materials (BOM).
β’ Contribute to the assessment and adoption of cutting-edge chip packaging technologies.
β’ Assist in deploying advanced computing systems within large-scale data center environments, optimizing PPA and TCO.
β’ A Bachelor's degree in Mechanical Engineering, Material Engineering, Electrical Engineering, Technology, Science, or a related field, or equivalent practical experience.
β’ At least 8 years of experience in chip package substrate design utilizing Cadence APD or Mentor Expedition.
β’ Proficiency in chip package substrate layout, design verification, DFM, and production taping out.
β’ Experience with design automation and scripting.
β’ English proficiency at an upper-intermediate level or higher.
β’ Experience collaborating with cross-functional teams, including chip design, SI/PI, and PCB design teams.
β’ Familiarity with 2.5D/3.5D advanced package design.
β’ Knowledge of physical verification flows (LVS, DRC, connectivity).
β’ Proficient in CAD for generating basic mechanical drawings, such as package outline drawings (POD).
β’ Capability to write scripts for customizing elements of the Cadence or Mentor workflows.
β’ Fully remote work opportunities available globally.
β’ Hybrid work model offered from office hubs.
β’ Flexible working hours.
β’ Consistent workload and reliable income.
β’ Performance evaluations and career development pathways.
β’ Mentorship programs.
β’ Personalized development plans.
β’ Access to individual learning resources through the corporate library.
β’ Support for public speaking initiatives.
β’ Company-wide tech and cultural events.
β’ Significant CSR initiatives.
β’ A supportive work environment that fosters collaboration, open communication, and mutual respect.
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