
Embedded Hardware Engineer
Posted 1 day ago

Posted 1 day ago
This is a fully remote position, open to applicants in Texas.
• Design embedded hardware and electronics while creating PCBs.
• Collaborate with i.MX8/i.MX9, ESP32, STM32, or comparable processors and microcontrollers.
• Implement and troubleshoot MIPI DSI/CSI, LVDS, HDMI, USB, SPI, I²C, UART, as well as camera and display interfaces.
• Execute schematic capture, PCB layout, bill of materials (BOM) creation, component selection, and cost optimization using Altium or Cadence.
• Tackle high-speed design challenges, ensure signal and power integrity, conduct thermal analysis, and address EMI/EMC issues, along with hardware debugging.
• Perform board bring-up, conduct lab testing, execute EDVT, and carry out functional and performance testing, including troubleshooting.
• Assist with FCC, IC, CE, and UL compliance certifications and resolve any related testing issues.
• Work in collaboration with suppliers, PCB fabrication and assembly teams, customers, and cross-functional engineering groups.
• Integrate sensor boards and various sensors, including motion, temperature, light, accelerometer, gyroscope, and magnetometer.
• A minimum of 5 years of relevant experience in embedded hardware and electronics design as well as PCB development.
• Extensive experience with i.MX8/i.MX9, ESP32, STM32, or similar processors/microcontrollers.
• Hands-on proficiency with MIPI DSI/CSI, LVDS, HDMI, USB, SPI, I²C, UART, and camera/display interfaces.
• Experience in schematic capture, PCB layout, Altium/Cadence, BOM creation, component selection, and cost optimization.
• Deep understanding of high-speed design, signal and power integrity, thermal analysis, EMI/EMC, and hardware debugging.
• Experience in board bring-up, lab testing, EDVT, functional and performance testing, and troubleshooting.
• Knowledge of FCC, IC, CE, and UL certifications, along with resolving issues during compliance testing.
• Experience collaborating with suppliers, PCB fabrication and assembly teams, customers, and cross-functional engineering teams.
• Experience with sensor boards and the integration of motion, temperature, light, accelerometer, gyroscope, and magnetometer sensors is advantageous.
• All visa types are accepted except for H1B transfers; C2C engagements are permitted.
• C2C engagements are permitted.
• Opportunity to work from the client's office in Austin, TX, if selected.
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TEKsystems
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