
Electronic Engineer
Posted 4 days ago

Posted 4 days ago
This is a fully remote position, open to applicants in Virginia.
• Lead the design, development, and validation of advanced high-speed PCIe-based hardware products.
• Manage the hardware development lifecycle from architecture and high-speed schematic design to PCB layout oversight, signal integrity analysis, lab bring-up, and transition to production.
• Define requirements, select components, create schematics, and oversee bills of materials.
• Design intricate multi-layer digital boards that incorporate power distribution networks (PDNs), high-speed SerDes and PCIe Gen 4/5/6 interfaces, baseboard management controllers (BMCs), AI accelerators, FPGAs, CPUs, and high-speed memory such as LPDDR5x.
• Evaluate and enhance signal integrity and power integrity, including eye diagrams, crosstalk, jitter, noise, voltage drop, and thermal performance.
• Direct the selection of PCB materials and stack-ups, high-speed routing and power-delivery constraints, component placement, and thermal management strategies.
• Oversee hands-on board bring-up, debugging, characterization, and laboratory validation processes.
• Collaborate with firmware and driver teams to facilitate AI acceleration workloads and system integration for deployment.
• Assist with EMI/EMC, safety, protocol compliance, interoperability, and environmental reliability testing.
• Produce reference design guides, schematic documentation, layout notes, block diagrams, operational concepts, and validation protocols.
• Support Marketing by preparing customer-ready documentation and solutions to promote customer adoption and design-in efforts.
• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related technical discipline.
• Over 5 years of demonstrated experience in designing complex, high-density, multi-layer (12+ layers) PCBs utilizing high-speed protocols such as 25G/56G/112G Ethernet, DDR4/DDR5, or PCIe Gen 3 or higher.
• Direct experience in PCIe board development, with a minimum understanding of Gen 3/4; knowledge of Gen 5/6 is an advantage.
• High level of proficiency with Cadence OrCAD/Allegro or Altium Designer.
• Practical experience, either directly or indirectly, with signal integrity/power integrity simulation software such as Ansys HFSS/SIwave or Cadence Sigrity.
• Strong skills in debugging and troubleshooting.
• Proficient in using high-speed digital test equipment.
• Comprehensive understanding of high-speed data transmission and power electronics design.
• Experience with multi-phase buck converters and power management ICs (PMICs) for high-power accelerators.
• Familiarity with PCB fabrication, SMT assembly, and PCBA thermal management.
• Must be U.S.-based; preference for candidates in the East Coast time zone.
• Candidates from the Washington, DC/DMV area are a plus.
• Competitive salary, comprehensive benefits, and equity participation.
• Flexible work environment.
• Options for remote work.
• Opportunity to influence the category narrative for next-generation AI infrastructure.
• Chance to be part of a company at the leading edge of Generative and Agentic AI technology.
• Opportunity to collaborate with a world-class global team across engineering, research, product, and business domains.
• Integral role in scaling a high-growth deep-technology company.
AnaVation LLC
TE Connectivity
TE Connectivity
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