Senior Packaging Technical Engineer – Hardware

This is a fully remote position, open to applicants in California.

📋 Description

• Develop and execute silicon pad ring designs

• Collaborate with a range of packaging technologies and intricate systems

• Specify and apply the interconnect scheme for chip pad rings and substrates

• Oversee the design process for package layouts

• Establish chip floor plans, pad rings, substrates, and ball outs

• Create a resilient electrical package

• Partner with engineers and managers from Circuit, Signal Integrity, RTL, Place and Route, substrate layout, and system design

• Effectively communicate with teams across the organization

• Propel technology initiatives across various functions and address complex technical challenges

⛳️ Requirements

• Bachelor of Science in Electrical Engineering (BSEE) or equivalent experience

• At least 8+ years of experience in board/system design

• Preferred experience in package design

• Desired knowledge of transmission line theory, power delivery, and signal integrity

• Scripting and programming skills in Perl, Python, or Tcl are preferred

• Familiarity with Cadence Skill and Excel is advantageous

• Capable of working with minimal supervision

• Strong problem-solving skills for complex technical issues

🏝️ Benefits

• Competitive salaries

• Comprehensive benefits package

• Equity options

• Benefits available for employees and their families