Senior Packaging Engineer

This is a fully remote position, open to applicants in Singapore.

📋 Description

• Develop, enhance, and characterize packaging processes for WLCSP technologies.

• Execute root cause analysis and implement corrective and preventive measures.

• Work collaboratively with R&D, design, equipment, and manufacturing teams to ensure smooth process transfer.

• Lead or engage in cross-functional teams for new product introduction (NPI) and process enhancement initiatives.

• Perform process capability analysis and promote continuous improvement efforts.

⛳️ Requirements

• Proven experience with Bumping, Flip-chip, and Wafer-Level Chip Scale Packaging (WLCSP) technologies.

• Proficiency in process optimization and sustaining advanced packaging processes.

• Capability to collaborate effectively with R&D, design, equipment, and manufacturing teams.

• Skills in root cause analysis and the 8D problem-solving methodology.

• Experience in defining and maintaining process specifications, control plans, and standard operating procedures (SOPs).

🏝️ Benefits

• Comprehensive and highly competitive compensation package.

• Quarterly bonus linked to innovation objectives.

• Equity grants.