Principal ASIC Package Design Engineer

This is a fully remote position, open to applicants in United States.

📋 Description

• Take ownership of ASIC packaging architecture for FC-BGA and MCM solutions, which includes substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.

• Lead comprehensive package-level trade studies encompassing cost, performance, power integrity, signal integrity, thermal management, manufacturability, and reliability.

• Develop a long-term packaging roadmap that aligns with upcoming ASIC nodes, bandwidth scaling, and multi-die integration.

• Establish and uphold organizational standards, methodologies, and best practices for package design.

• Drive the detailed design of FC-BGA packages for high-pin-count ASICs featuring high-speed SerDes, dense power grids, and RF signal content.

• Define and evaluate substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning.

• Collaborate with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces.

• Own the package-level SI/PI strategy, which includes high-speed digital interfaces, PDN design, and decoupling strategies.

• Lead the thermal architecture at the package level, considering lid selection, TIMs, heat spreaders, and mechanical interfaces for system cooling.

• Manage relationships with external packaging vendors, substrate suppliers, and OSATs, focusing on vendor qualification, capability assessment, contract negotiation, and performance/quality scorecarding.

• Drive material selection, substrate technology decisions, and optimization of the assembly process.

⛳️ Requirements

• A Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related discipline.

• Over 10 years of experience in ASIC package design, specifically with extensive knowledge in FC-BGA.

• Demonstrated experience in delivering high-pin-count, high-performance ASIC packages into production.

• Strong comprehension of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICs.

• Proficient in SI/PI and electromagnetic simulation tools such as SIWave, HFSS, and ADS.

• Experience working directly with OSATs and substrate vendors.

• Familiarity with packaging qualification and testing methodologies.

• The selected candidate must either qualify as a “U.S. person” as defined by 22 C.F.R. § 120.15 or be eligible for a federally issued export control license.

🏝️ Benefits

• Competitive salary and performance-based bonuses.

• Comprehensive health and wellness benefits.

• Opportunities for professional development and growth.

• Flexible work arrangements and a supportive work environment.