
High-Speed Analog Layout Engineer
Posted 8 hours ago

Posted 8 hours ago
This is a fully remote position, open to applicants in Texas.
• Develop physical silicon layouts for high-speed or high-frequency mixed-signal circuits, such as SerDes, ADCs, DACs, PLLs, and high-speed blocks.
• Formulate block-level and chip-top-level floor plans.
• Oversee the integration of hierarchical blocks.
• Manage micro-bump or package-aware co-design.
• Tackle layout-dependent effects, device matching, common-centroid structures, guard rings, isolation, and shielding.
• Ensure compliance with DRC, LVS, ERC, antenna rules, as well as EM/IR reliability and ESD protection.
• Must possess experience with TSMC 4NM technology.
• Typically, 5 to 12+ years of practical custom IC layout experience is required.
• Familiarity with deep sub-micron or advanced CMOS/FinFET nodes is essential.
• Experience with advanced nodes such as TSMC N3, N5, or N7 is necessary.
• Proficiency at lower nodes (N3, N5) is crucial.
• Background in designing physical silicon layouts for high-speed or high-frequency mixed-signal circuits is needed.
• Understanding of floor planning and hierarchical block integration is required.
• Experience in micro-bump or package-aware co-design is advantageous.
• Knowledge of layout-dependent effects (LOD, WPE, LDE) is important.
• Expertise in device matching and common-centroid structures is expected.
• Experience with guard rings, isolation, and shielding, including coaxial, differential, and ground shields is necessary.
• Proven experience in closing DRC, LVS, ERC, antenna rules, EM/IR reliability, and ESD protection is required.
• Contract engagement for a duration of 6–12 months.
Aira
RTX
L3Harris Technologies
L3Harris Technologies
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