Head of Device Fabrication, Advanced Packaging, and Assembly

This is a fully remote position, open to applicants in Singapore.

📋 Description

• Define and implement the roadmap, standards, and investment priorities for the fabrication, packaging, assembly, and testing of quantum processors.

• Build, lead, and cultivate a high-performing team of engineers, scientists, technical specialists, and managers across Singapore and Japan.

• Spearhead the development and optimization of foundry processes from initial concept to production.

• Drive the advancement and industrialization of innovative packaging, assembly, bonding, and interconnect solutions.

• Establish and maintain strategic relationships with foundries, suppliers, and technology partners.

• Oversee R&D programs related to foundry, assembly, and packaging technologies.

• Develop qualification and control processes to ensure scalable and reliable manufacturing.

• Collaborate with engineering, design, product, and architecture teams to convert requirements into manufacturable specifications.

• Maintain comprehensive development plans, budgets, supplier relations, risk assessments, and performance metrics.

• Ensure that process and packaging technologies comply with quality, reliability, safety, export-control, regulatory, and contractual standards.

⛳️ Requirements

• A degree (or equivalent experience) in Semiconductor Engineering, Materials Science, Physics, Microelectronics, Mechanical Engineering, Chemical Engineering, or a related technical field.

• Proven success in leading and developing multidisciplinary technical teams, including senior engineers, specialists, and managers.

• Extensive experience in semiconductor process development, advanced packaging, assembly, or device industrialization within a foundry, IDM, OSAT, deep-tech, or similar setting.

• Demonstrated ability to advance process and technology development from concept to qualification, yield improvement, supplier transfer, and readiness for production.

• Strong technical knowledge in microfabrication, wafer processing, lithography, deposition, etching, wafer bonding, die attach, interconnects, packaging, metrology, reliability, or failure analysis.

• Experience in selecting, managing, and nurturing relationships with foundries, OSATs, suppliers, and external manufacturing partners.

• Proven capability to collaborate across multiple functions with design, ASIC, systems engineering, product, and architecture teams to deliver manufacturable solutions.

• Established ability to lead in complex, multi-site, or international environments.

🏝️ Benefits

• Opportunity to influence the future of quantum computing products and the organization.

• Career advancement opportunities.

• Chances to expand expertise.

• Engaging, high-impact engineering challenges.

• Collaborate with world-class scientists and engineers.

• An inclusive environment where everyone can thrive.

• Commitment to diversity and inclusion.

• A welcoming atmosphere for team members from all backgrounds.