This is a fully remote position, open to applicants in California.

📋 Description

• Lead the formulation and implementation of corporate-level strategies for high-speed signaling technologies in advanced semiconductor packaging, connectors, and sockets.

• Supervise the technical direction and execution of next-generation products, which include ultra-mobile to high-performance AI and HPC platforms.

• Design and deliver innovative interconnect and packaging solutions for UCIe, HBM, DDR, PCIe, and 224G/448G SerDes.

• Facilitate advanced packaging solutions for co-packaged optics, stacked die, chiplet-based architectures, and IVR solutions.

• Create modeling and characterization flows, automate processes, and implement design-for-high-volume-manufacturing techniques.

• Offer strategic guidance as a recognized subject matter expert to senior leadership regarding emerging technologies, technology investments, and research priorities in signaling, packaging, and system integration.

⛳️ Requirements

• Over 15 years of experience leading innovations in high-speed signal integrity, computational electromagnetics, and semiconductor assembly technologies.

• MS or PhD in Electrical Engineering or a related field, accompanied by 15+ years of industry experience.

• Proven hands-on experience in the invention and deployment of advanced solutions such as EMIB, UCIe, CPO, and high-density connectors.

• Extensive expertise in electrical, computer, and packaging engineering, and their application in product development.

• Demonstrated capacity to manage and mentor teams of highly skilled engineers, establish methodologies, and deliver complex projects from research through to high-volume manufacturing.

• A solid record of transitioning advanced signal integrity concepts from research phases to product realization.

• Pioneer-level experience in industry-standard high-speed signaling technology.

• In-depth understanding of operational and manufacturing challenges related to package substrates, PCBs, cables, and connectors.