
Analog Layout Engineer
Posted 6 days ago

Posted 6 days ago
This is a fully remote position, open to applicants in Texas.
β’ Develop physical silicon layouts for high-frequency or high-speed mixed-signal circuits, including SerDes, ADCs, DACs, PLLs, and other high-speed components.
β’ Generate both block-level and chip-top-level floor plans.
β’ Oversee the integration of hierarchical blocks.
β’ Manage co-design processes that consider micro-bump or package awareness.
β’ Tackle layout-dependent effects, ensuring device matching, implementing common-centroid structures, and integrating guard rings and isolation or shielding techniques.
β’ Achieve closure on DRC, LVS, ERC, antenna rules, EM/IR reliability, and ESD protection requirements.
β’ A minimum of 7 years of relevant industry experience.
β’ Typically 5 to 12+ years of direct custom IC layout experience within deep sub-micron or advanced CMOS/FinFET nodes.
β’ Critical experience at lower nodes (N3, N5).
β’ Mandatory experience with TSMC 4NM technology.
β’ Proficiency in high-speed analog layout techniques.
β’ Familiarity with floor planning and integration processes, encompassing block-level and chip-top-level floor plans, hierarchical block integration, and micro-bump or package-aware co-design.
β’ Understanding of layout-dependent effects (LOD, WPE, LDE), device matching, common-centroid structures, guard rings, and methods for isolation or shielding.
β’ Competence in DRC, LVS, ERC, antenna rules, EM/IR reliability, and ESD protection methodologies.
β’ Must be eligible to work under the specified visa requirements; H1B transfers are not permitted.
β’ Contract employment opportunities.
β’ Acceptance of all visa types, except for H1B transfers.
β’ C2C engagements are permitted.
Sargent & Lundy
Willow Innovations, Inc.
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