Senior OSAT Engineer

This is a fully remote position, open to applicants in Taiwan.

📋 Description

• Oversee technical interactions with OSAT suppliers regarding the development of assembly and test processes, yield enhancement, quality improvements, and readiness for high-volume manufacturing.

• Facilitate the introduction of new products (NPI) from engineering prototypes to production launch, ensuring that OSAT capabilities align with the electrical, thermal, and mechanical specifications for FPGA and SoC products.

• Enhance packaging and testing architectures for improved performance, cost-efficiency, and reliability, focusing on advanced packaging, flip-chip BGA, high-pin-count packages, substrate technologies, wafer-level solutions, and burn-in/FT coverage.

• Assess and enhance manufacturing performance through data-driven analyses; detect systemic issues and spearhead root cause investigations and corrective measures.

• Collaborate with Test Engineering, Package Design, Product Engineering, DFM, and Quality teams to optimize processes, conduct failure analyses, and improve manufacturability.

• Establish and uphold process control systems, SPC methodologies, automation enhancements, and lean manufacturing practices at OSAT.

• Assist in cost reduction initiatives, including BOM optimization, process simplification, and cycle time improvements.

• Monitor supplier performance metrics (yield, DPPM, cost, cycle time, OEE) and provide updates along with risk assessments and mitigation strategies.

• Lead or assist in reliability testing and package qualification activities in accordance with industry standards (JEDEC, IPC, AEC-Q).

• Foster a robust technical relationship and communication rhythm with OSAT partners to ensure transparency, collaboration, and effective escalation management.

⛳️ Requirements

• A Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related discipline.

• 10+ years of experience in semiconductor assembly, packaging, or test engineering.

• Practical experience in OSAT manufacturing environments, including wafer finishing, substrate attachment, interconnect packaging, testing, and burn-in processes.

• Strong technical knowledge of backend manufacturing processes: flip-chip, wire bonding, underfill, molding, final testing, and reliability stress analysis.

• Proven capability to evaluate yield, reliability, and cost data to inform engineering decisions and drive improvements.

• Demonstrated success in collaborating with international suppliers and cross-functional teams.

• Excellent skills in statistical analysis, along with strong written and verbal communication abilities, including technical reporting and supplier interactions.

🏝️ Benefits

• Health insurance

• 401(k) matching

• Flexible working hours

• Paid time off

• Remote work options