Senior Manager, RF Design

This is a fully remote position, open to applicants in Oregon.

📋 Description

• Lead, mentor, and develop a team of RF Probe Card Designers.

• Set team objectives, performance standards, and individual growth plans.

• Recruit, hire, guide, and retain skilled technical professionals.

• Oversee the production design of RF and microwave probe card solutions.

• Provide technical guidance for intricate RF probe card architectures, transmission line designs, and probe technologies.

• Enhance RF probe card design methodologies, tools, regulations, workflows, quality, scalability, automation, and productivity.

• Establish design metrics and utilize data-driven decision-making for process enhancements.

• Promote design standardization, methodology development, design reuse, and best practices across product families and locations.

• Collaborate with teams from engineering, operations, manufacturing, supply chain, quality, product management, and global customers.

• Allocate resources across multiple complex development projects and ensure completion of milestones and product releases.

• Provide management with project updates, resource planning, and performance metrics.

• Facilitate the transition of new products from development to production design.

• Advocate for Design for Manufacturability and Design for Assembly principles.

• Lead technical investigations and corrective measures for issues impacting customers.

• Establish strong SIOP processes with cross-functional leadership.

• Develop KPIs and initiatives for continuous improvement.

• Manage change in design methodologies, rules, CAD tools, and engineering workflows.

⛳️ Requirements

• Bachelor's degree in Electrical Engineering, Physics, or a related engineering field, or equivalent professional experience.

• At least 8 years of experience in semiconductor testing, RF product development, probe cards, advanced interconnect technologies, microelectronics, PCB design, or similar fields.

• A minimum of 3 years in engineering leadership, technical leadership, or management of personnel.

• At least 10 years of relevant experience with a Bachelor's degree; or 8 years with a Master's degree; or a PhD with 5 years' experience; or equivalent professional background.

• Proven track record of leading cross-functional development projects from concept through to production release.

• Experience in managing technical professionals and building high-performing teams.

• Background in semiconductor wafer probing, RF test systems, or advanced packaging technologies.

• Experience leading global engineering teams and cross-site development initiatives.

• Strong grasp of RF, microwave, and high-speed electrical design principles.

• Familiarity with RF probe cards, RF interposers, test interfaces, substrates, or comparable semiconductor test hardware.

• Understanding of PCB, thin-film, ceramic, and advanced substrate technologies.

• Knowledge of SMT manufacturing processes.

• Experience in developing and implementing engineering design methodologies, standards, and best practices.

• Proven ability to drive design automation and improve design productivity.

• Working knowledge of DFMEA, PFMEA, Ishikawa, IS/IS NOT, root-cause analysis, and corrective action methodologies.

• Familiar with Lean Manufacturing, Six Sigma, DOE, SPC, and Gage R&R principles.

• Exceptional problem-solving and decision-making abilities.

• Strong written and verbal communication skills.

🏝️ Benefits

• Medical, dental, and vision insurance.

• Life insurance coverage.

• Disability insurance.

• 401(k) plan with company matching.

• Employee stock purchase plan (ESPP).

• Paid time off.

• Quarterly profit-sharing bonuses.

• Flexible spending or savings accounts.