Dry Etch Process Development Engineer

This is a fully remote position, open to applicants in New York.

📋 Description

• Design, validate, and maintain dry etch (plasma) unit processes for cutting-edge memory technologies (e.g., dielectric, conductor, and hardmask etching)

• Enhance essential process metrics such as CD control, etch profile/anisotropy, selectivity, microloading, uniformity, and line edge/line width roughness

• Lead initiatives for defect reduction and yield enhancement utilizing inline/out-of-line metrology, DOEs, SPC, and statistical data analysis

• Conduct root-cause analysis and implement corrective measures for process deviations, tool health concerns, and integration-related failures

• Collaborate with equipment suppliers on chamber matching, hardware and recipe development, evaluation of new capabilities, and improvements in cost-of-ownership

• Record process baselines, change controls, and learnings; convey outcomes and facilitate technology transfer to high-volume manufacturing

⛳️ Requirements

• M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Mechanical Engineering, or a related engineering/technical discipline pertinent to plasma processing and semiconductor manufacturing

• B.S. with over 3 years of semiconductor processing experience, particularly in dry etch/plasma etch, will also be accepted

• Background in semiconductor process development or sustaining engineering, including DOE planning/execution and statistical data analysis

• Proficient understanding of plasma etch fundamentals, chamber hardware, and process characterization (profile, CD, selectivity, uniformity, defectivity)

• Strong ability to work collaboratively across cross-functional technical teams and communicate findings effectively

🏝️ Benefits

• A selection of medical, dental, and vision plans

• Income protection in the event of illness or injury

• Paid family leave

• Comprehensive paid time-off program

• Paid holidays