Director – Field Application Engineering, EMEA

This is a fully remote position, open to applicants in France.

📋 Description

• Act as the senior primary technical liaison for EMEA customers, engaging with both engineers and senior leadership.

• Lead the hardware bring-up, board integration, and embedded system debugging, both on-site and remotely.

• Provide support for chip-down designs, custom carrier board development, and embedded Linux integration.

• Assist customers in deploying AI models and inference pipelines using the Voyager SDK.

• Troubleshoot PCIe, power sequencing, signal integrity, thermal, and BSP bring-up challenges.

• Drive pre-sales engagement and secure design wins among OEM/ODM, integrators, and end users throughout Europe.

• Establish FAE processes, documentation, and support infrastructure for the EMEA region.

• Recruit, mentor, and manage EMEA FAE engineers as the team expands.

• Align priorities with commercial objectives; contribute to the overall EMEA and global FAE strategy.

• Serve as the senior technical link between EMEA customer requirements and global R&D and Product teams.

• Relay customer feedback and roadmap suggestions to Product Management and R&D.

• Maintain relationships with key accounts, distributors, and channel partners across EMEA.

• Collaborate with Sales and Business Development on product launches, onboarding, and competitive intelligence.

• Represent Axelera AI at EMEA industry events, conferences, and technical forums.

⛳️ Requirements

• Master’s degree in Electrical Engineering, Computer Engineering, Embedded Systems, or a related discipline.

• Over 10 years of experience in customer-facing FAE or applications engineering within semiconductor, AI, or embedded systems.

• More than 5 years of experience leading FAE teams or managing technical customer-facing roles.

• Strong background in embedded board design, chip-down development, and custom carrier board design.

• Experience with ARM-based SoCs and embedded compute modules.

• Familiarity with embedded AI or computer vision workloads.

• Solid understanding of high-speed digital interfaces, signal integrity, power sequencing, and thermal design.

• Proficiency in embedded Linux, bootloaders, BSPs, and low-level system bring-up.

• Demonstrated ability to resolve complex hardware/software integration challenges.

• Knowledge of AI accelerators, NPUs, GPUs, or edge AI platforms.

• Commercially minded with a proven track record of driving design wins through complete evaluation and adoption cycles.

• Excellent communication skills in English, with fluency in French and/or Italian.

• Willingness to travel extensively across EMEA.

• Familiarity with Yocto, Buildroot, or Debian-based embedded Linux systems is preferred.

• Experience with PCIe enumeration, MSI/MSI-X, DMA, and memory subsystems is preferred.

• Background in production validation, manufacturing bring-up, and thermal/power optimization for AI systems is preferred.

• Established technical relationships within EMEA’s OEM/ODM, system integrator, or AI ecosystem are preferred.

• Proficiency in additional EMEA languages (German, Arabic, Spanish) is a plus and preferred.

🏝️ Benefits

• This is an opportunity to shape and contribute to a dynamic, fast-growing, international organization. We provide an attractive compensation package that includes a pension plan, comprehensive employee insurance, and the option to acquire company shares.

• An open culture that fosters creativity and continuous innovation awaits you.

• Collaborative ownership and the freedom to take responsibility characterize our teamwork approach.