Director – Field Application Engineering

This is a fully remote position, open to applicants in Taiwan.

📋 Description

• Serve as the senior primary technical liaison for customers in Taiwan, interacting with both engineers and senior leadership.

• Oversee hardware bring-up, board integration, and embedded system debugging both on-site and remotely.

• Provide support for chip-down design, custom carrier board development, and embedded Linux integration.

• Assist customers in deploying AI models and inference pipelines using the Voyager SDK.

• Troubleshoot issues related to PCIe, power sequencing, signal integrity, thermal management, and BSP bring-up.

• Lead pre-sales efforts and secure design wins with OEM/ODM partners, integrators, and end users.

• Develop FAE processes, documentation, and support infrastructure for the Taiwan region.

• Recruit, mentor, and manage APAC FAE engineers as the team expands.

• Align priorities with commercial objectives and contribute to both APAC and global FAE strategies.

• Collect and communicate customer feedback and roadmap suggestions to Product Management and R&D.

• Maintain relationships with key accounts, distributors, and channel partners in Taiwan.

• Collaborate with Sales and Business Development on product launches, onboarding processes, and competitive analysis.

⛳️ Requirements

• A Master’s degree in Electrical Engineering, Computer Engineering, Embedded Systems, or a related discipline.

• Over 10 years of experience in customer-facing FAE or applications engineering within the semiconductor, AI, or embedded systems sectors.

• At least 5 years of experience in leading FAE teams or managing technical customer-facing roles.

• Extensive experience in embedded board design, chip-down development, and custom carrier board design.

• Familiarity with ARM-based SoCs and embedded computing modules.

• A solid understanding of high-speed digital interfaces, signal integrity, power sequencing, and thermal design.

• Proficiency in embedded Linux, bootloaders, BSPs, and low-level system initialization.

• Demonstrated ability to troubleshoot complex hardware/software integration challenges.

• Knowledge of AI accelerators, NPUs, GPUs, or edge AI platforms.

• A commercial mindset with a proven track record of driving design wins through comprehensive evaluation and adoption processes.

• Excellent English communication skills and willingness to travel within Taiwan and occasionally within the APAC region.

🏝️ Benefits

• A director-level position that offers genuine ownership and a defined path to regional leadership.

• Opportunity to work at the forefront of edge AI hardware with direct engagement with world-class R&D.

• A remote-first, Taiwan-based role within a well-established and expanding local team.

• A collaborative international culture that emphasizes technical expertise, customer focus, and execution.

• A competitive compensation package, which includes a pension plan, comprehensive employee insurance, and the option to acquire company shares.