Advanced Application Engineer – Automotive, German required

This is a fully remote position, open to applicants in Romania.

📋 Description

• Act as the main technical liaison for automotive clients engaged in the development and integration of advanced semiconductor applications within ADAS systems.

• Deliver expert troubleshooting for intricate ADAS applications, process, or reliability challenges—including sensor fusion, thermal management, and system safety—throughout both development and production stages.

• Assist clients during design reviews, process integration discussions, and root-cause analyses related to ADAS sensor modules, control units, and safety-critical electronics.

• Collaborate as a peer engineer with automotive customer technical teams, offering proactive solutions and industry best practices to enhance ADAS system performance and reliability.

• Convert customer requirements into precise technical specifications, test plans, and application recommendations.

• Facilitate design-in activities, encompassing material selection, process window definition, and application validation.

• Supply simulation inputs, characterization data, and application notes to boost customer confidence and promote adoption.

• Assist in minimizing re-spins, last-minute changes, and re-qualification cycles.

⛳️ Requirements

• Bachelor’s degree in electrical engineering, Materials Science, Chemical Engineering, Thermal Engineering, Physics, or a related technical discipline.

• A Master’s degree is preferred but not mandatory.

• Proficiency in German is essential, ideally as a native speaker.

• Willingness to travel up to 50% of the year.

• Over 5 years of experience in semiconductor applications engineering, technical support, process engineering, or reliability engineering.

• Practical experience collaborating with IDMs, foundries, fabless companies, Automotive OEMs, or Tier 1 suppliers.

• Strong understanding of semiconductor manufacturing processes and inter-company collaboration models.

• In-depth knowledge of semiconductor devices, materials, packaging, or process integration.

• Experience with advanced packaging and integration concepts such as 2.5D/3D, chiplets, fan-out, or system-level considerations is advantageous.

• Capability to analyze and convey complex technical data and failure mechanisms.

• Comfort in working across development, qualification, and high-volume manufacturing settings.

• Excellent engineer-to-engineer communication skills with the ability to establish technical credibility.

• A structured problem-solving approach and a focus on root-cause analysis.

• Capacity to manage multiple customer programs concurrently with minimal oversight.

• Comfort in presenting technical concepts to both highly technical and mixed technical/commercial audiences.

🏝️ Benefits

• Willingness to travel (typically 20–40%) to customer sites, fabs, or OEM locations as needed.

• Hybrid work model based on customer proximity and lab access requirements.